? semiconductor components industries, llc, 2007 february, 2007 ? rev.6 1 publication order number: nl27wz04/d nl27wz04 dual inverter the nl27wz04 is a high performance dual inverter operating from a 1.65 v to 5.5 v supply. high impedance ttl compatible inputs significantly reduce current loading to input drivers while ttl compatible outputs offer improved switching noise performance. features ? extremely high speed: t pd 2.0 ns (typical) at v cc = 5 v ? designed for 1.65 v to 5.5 v v cc operation ? over voltage tolerant inputs and outputs ? lvttl compatible ? interface capability with 5 v ttl logic with v cc = 3 v ? lvcmos compatible ? 24 ma balanced output sink and source capability ? near zero static supply current substantially reduces system power requirements ? replacement for nc7w04 ? chip complexity: fet = 72; equivalent gate = 18 ? pb?free packages are available v cc in a1 out y1 gnd in a2 out y2 1 figure 1. pinout (top view) figure 2. logic symbol in a2 out y2 1 out y1 in a1 1 2 34 5 6 see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information marking diagrams sc?88/sc70?6/sot?363 df suffix case 419b tsop?6 dt suffix case 318g http://onsemi.com 1 1 m5 m 1 m5 = device code m = date code* = pb?free package *date code orientation and/or position and underbar may vary depending upon manufacturing location. (note: microdot may be in either location) function table l h h l pin assignment 1 2 3 4 5 6 a input y output in a1 gnd in a2 out y2 v cc out y1 m5 m m 1 6
nl27wz04 http://onsemi.com 2 maximum ratings characteristics symbol value unit dc supply voltage v cc ?0.5 to +7.0 v dc input voltage v i ?0.5 v i +7.0 v dc output voltage output in high or low state (note 1) v o ?0.5 v o 7.0 v dc input diode current v i < gnd i ik ?50 ma dc output diode current v o < gnd i ok ?50 ma dc output source/sink current i o 50 ma dc supply current per supply pin i cc 100 ma dc ground current per ground pin i gnd 100 ma storage temperature range t stg ?65 to +150 c power dissipation in still air sc?88, tsop?6 (note 2) p d 200 mw thermal resistance sc?88, tsop?6 (note 2) ja 333 c/w lead temperature, 1 mm from case for 10 seconds t l 260 c junction temperature under bias t j +150 c esd withstand voltage human body model (note 3) machine model (note 4) charged device model (note 5) v esd > 2000 > 200 n/a v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. i o absolute maximum rating must be observed. 2. measured with minimum pad spacing on an fr4 board, using 10 mm?by?1 inch, 2?ounce copper trace with no air flow. 3. tested to eia/jesd22?a114?a 4. tested to eia/jesd22?a115?a 5. tested to jesd22?c101?a recommended operating conditions parameter symbol min max unit supply voltage operating data retention only v cc 1.65 1.5 5.5 5.5 v input voltage v i 0 5.5 v output voltage (high or low state) v o 0 5.5 v operating free?air temperature t a ?40 +85 c input transition rise or fall rate v cc = 2.5 v 0.2 v v cc =3.0 v 0.3 v v cc =5.0 v 0.5 v t/ v 0 0 0 20 10 5 ns/v
nl27wz04 http://onsemi.com 3 dc electrical characteristics v cc t a = 25 c ?40 c t a 85 c parameter condition symbol (v) min typ max min max unit high?level input voltage v ih 1.65?1.95 0.75 v cc 0.75 v cc v 2.3 to 5.5 0.7 v cc 0.7 v cc low?level input voltage v il 1.65?1.95 0.25 v cc 0.25 v cc v 2.3 to 5.5 0.3 v cc 0.3 v cc high?level output voltage v in = v il i oh = ?100 a v oh 1.65 to 5.5 v cc ? 0.1 v cc v cc ? 0.1 v i oh = ?3 ma 1.65 1.29 1.52 1.29 i oh = ?8 ma 2.3 1.9 2.1 1.9 i oh = ?12 ma 2.7 2.2 2.4 2.2 i oh = ?16 ma 3.0 2.4 2.7 2.4 i oh = ?24 ma 3.0 2.3 2.5 2.3 i oh = ?32 ma 4.5 3.8 4.0 3.8 low?level output voltage v in = v ih i ol = 100 a v ol 1.65 to 5.5 0.1 0.1 v i ol = 3 ma 1.65 0.08 0.24 0.24 i ol = 8 ma 2.3 0.20 0.3 0.3 i ol = 12 ma 2.7 0.22 0.4 0.4 i ol = 16 ma 3.0 0.28 0.4 0.4 i ol = 24 ma 3.0 0.38 0.55 0.55 i ol = 32 ma 4.5 0.42 0.55 0.55 input leakage current v in = v cc or gnd i in 0 to 5.5 0.1 1.0 a power off?output leakage current v out = 5.5 v i off 0 1 10 a quiescent supply current v in = v cc or gnd i cc 1.65 to 5.5 1 10 a ????????????????????????????????? ac electrical characteristics t r = t f = 2.5 ns; c l = 50 pf; r l = 500 ???????? ? ?????? ? ???????? parameter ???????? ? ?????? ? ???????? condition ???? ???? ???? ? ?? ? ???? v cc (v) ?????? ?????? c ??????? ??????? c t a 85 c ?? ?? ?? ???? ???? ??? ??? ?? ?? ??? ??? ???? ???? ???? ???? ???????? ? ?????? ? ? ?????? ? ? ?????? ? ? ?????? ? ? ?????? ? ? ?????? ? ???????? propagation delay (figure 3 and 4) ???????? ???????? c l = 15 pf ???? ? ?? ? ? ?? ? ? ?? ? ? ?? ? ? ?? ? ? ?? ? ???? t plh t phl ???? ???? ??? ??? ?? ?? ??? ??? ???? ???? ???? ???? ?? ?? ?? ?? ?? ?? ?? ?? ???????? ???????? c l = 15 pf ???? ???? ??? ??? ?? ?? ??? ??? ???? ???? ???? ???? ???????? ???????? c l = 15 pf ???? ???? 0.2 ??? ??? ?? ?? ??? ??? ???? ???? ???? ???? ???????? ???????? c l = 15 pf ???? ? ?? ? ???? 3.3 0.3 ??? ??? ?? ?? ??? ??? ???? ???? ???? ???? ???????? ???????? c l = 50 pf ??? ??? ?? ?? ??? ??? ???? ???? ???? ???? ???????? ???????? c l = 15 pf ???? ? ?? ? ???? 5.0 0.5 ??? ??? ?? ?? ??? ??? ???? ???? ???? ???? ???????? ???????? c l = 50 pf ??? ??? ?? ?? ??? ??? ???? ???? ???? ???? capacitive characteristics parameter symbol condition typical unit input capacitance c in v cc = 5.5 v, v i = 0 v or v cc 2.5 pf power dissipation capacitance (note 6) c pd 10 mhz, v cc = 3.3 v, v i = 0 v or v cc 10 mhz, v cc = 5.5 v, v i = 0 v or v cc 9 11 pf 6. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no?load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
nl27wz04 http://onsemi.com 4 v cc gnd 50% 50% v cc a y t phl t plh figure 3. switching waveforms propagation delays t r = t f = 2.5 ns, 10% to 90%; f = 1 mhz; t w = 500 ns pulse generator r t dut v cc r l c l r t = z out of pulse generator (typically 50 ) figure 4. test circuit ordering information device package shipping ? nl27wz04dft2 sc?88/sc70?6/sot?363 3000 / tape & reel NL27WZ04DFT2G sc?88/sc70?6/sot?363 (pb?free) nl27wz04dtt1 tsop?6 nl27wz04dtt1g tsop?6 (pb?free) ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
nl27wz04 http://onsemi.com 5 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419b?01 obsolete, new standard 419b?02. e 0.2 (0.008) mm 123 d e a1 a a3 c l 654 ?e? b 6 pl sc?88/sc70?6/sot?363 case 419b?02 issue w dim min nom max millimeters a 0.80 0.95 1.10 a1 0.00 0.05 0.10 a3 b 0.10 0.21 0.30 c 0.10 0.14 0.25 d 1.80 2.00 2.20 0.031 0.037 0.043 0.000 0.002 0.004 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 min nom max inches 0.20 ref 0.008 ref h e h e e 1.15 1.25 1.35 e 0.65 bsc l 0.10 0.20 0.30 2.00 2.10 2.20 0.045 0.049 0.053 0.026 bsc 0.004 0.008 0.012 0.078 0.082 0.086 mm inches scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
nl27wz04 http://onsemi.com 6 package dimensions tsop?6 case 318g?02 issue s 23 4 5 6 d 1 e b e a1 a 0.05 (0.002) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. c l 0.95 0.037 1.9 0.075 0.95 0.037 mm inches scale 10:1 1.0 0.039 2.4 0.094 0.7 0.028 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e dim a min nom max min millimeters 0.90 1.00 1.10 0.035 inches a1 0.01 0.06 0.10 0.001 b 0.25 0.38 0.50 0.010 c 0.10 0.18 0.26 0.004 d 2.90 3.00 3.10 0.114 e 1.30 1.50 1.70 0.051 e 0.85 0.95 1.05 0.034 l 0.20 0.40 0.60 0.008 0.039 0.043 0.002 0.004 0.014 0.020 0.007 0.010 0.118 0.122 0.059 0.067 0.037 0.041 0.016 0.024 nom max 2.50 2.75 3.00 0.099 0.108 0.118 h e ? ? 0 1 0 0 1 0 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, r epresentation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5773?3850 nl27wz04/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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